Plant Capabilities

We are equipped with state-of-the-art infrastructure and technologically advanced machines to empower us in solving the most complex requirements of clientele. Our manufacturing plant spans over the XXX sq. m. We utilize machineries and raw materials that comply with international standards such as IPC4101 & IPC-CF-150E. We also possess quality maintenance systems, and availed certifications from the international certification bodies such as ISO. Our plant has extensive capabilities to manufacture multilayer PCBs for telecommunication products, oil & gas applications, military electronics, and others.

Our Plant

Our Plant Capability

Cnc Machine

Photo Printing Machine

Automatic Optical Inspection

Flying Probe Testing Machine

Develop Etch Strip Line

Screen Printing Machine

Scrubbing Machine

Impedance-testing-machine

Standard Materials

All Laminate & Prepregs as per IPC4101 & IPC-CF-150E, All Raw Material Nema grade, FR-4, 94V-1, Material used: – Multifunctional Glass Epoxy FR4 (Tg 135), FR4 (Tg >150), FR4 (TG>170).

Approvals & QMS

PCB Fabrication & inspection as per IPC-6012A, Class 2, AQL 0.25, and General inspection level II, Company is ISO 9001-2008 Certified.

PCB Manufactured for

Industrial Controls / Process Automation, Automobile Electronics, Computers / Peripherals / DataComm, Telecommunications products, Scientific and Biomedical equipment, Military and Aviation Electronics.

Our Plant

High Lights Of Plant Facilities

Full fledged CAM facility.
Polar instrument for Control Impedance Layer stack up generation software & impedance testing.
AOI (Automated Optical Inspection) System – In-house Automated Optical Inspection facility for Photo tool, all Inner Layers & outer Layer inspection. Machine from Machvision Taiwan.
0.1 mm. CNC drilling capability, Machine from Tong Tai Taiwan.
Pulse rectifier to achieve uniform Copper Plating thickness on surface & hole wall.
CMI make hole wall CU thickness & Surface CU thickness instruments.
PLASMA machine from Jesagi-Hankook Korea – Latest Technology for De-smear etch-back & surface cleaning.
Flying Probe Tester with 8 probes from ATG Germany.
Laboratory for process monitoring.
Microsection facility, Equipment from MEIJI-Japan, Camera with PC interface software.
Solderability tester.
DM Water Plant – 100% water usage in process is DM water. Safety/Environmental Full-time IEPA Class ‘K’ Licensed Chemist Ion Exchange wastewater processing.

Our Plant

Final Finishes

As per standard	IPC-SM-840, Class III, type B.
Photoimageble	Green, Blue, Red, Black, White & Clear as per IPC-SM-840
Component Idents	White, Yellow, Black
Peel able Mask	Blue or Red
Solder mask Thickness Min.	10 micron
Solder mask Dam Min.	3 mil {0.75 mm}
Solder mask Clearance	> 1 mil

Board Dimensions

As per standard	IPC-SM-840, Class III, type B.
Photoimageble	Green, Blue, Red, Black, White & Clear as per IPC-SM-840
Component Idents	White, Yellow, Black
Peel able Mask	Blue or Red
Solder mask Thickness Min.	10 micron
Solder mask Dam Min.	3 mil {0.75 mm}
Solder mask Clearance	> 1 mil

Copper Cladding

Inner Layer Max Base Cu Thickness	4 oz {0.14 mm}
Inner Layer Min Base Cu Thickness	½ oz {0.017 mm}
Outer Layer Max Base Cu Thickness	4 oz {0.14 mm}
Outer Layer Min Base Cu Thickness	1/3 oz {0.012mm}
Aspect Ratio (Thickness to Drill)	16:1 for 1.6 mm and 12:1
Copper Plating	Minimum 0.001” {25 Micron} with hardness of 150 Knoop Maximum
Min. track/Space	3/3 mil with base copper 1/3 & ½ oz4/4 mil with base copper 1/3, ½ & 1 oz 5/5 mil with base copper 1/3, ½, 1 & 2 oz 6/6 mil with base copper 1/3, ½, 1 & 2 oz
Impedance Tolerance Min.	+/-10% {Impedance stack-up design & verification Service}
Thermal Stress Test	288 Deg. Centi. 10 sec. One shot
Flammability	94V-0
Drill Hole Diameter Max.	Unlimited
Drill Hole Diameter Min.	0.15 mm {6mil}