DFM – Tech Specification

We became one of the most trusted and reliable partners for our clients due to a single important factor: Attention to detail. With our multilayer PCB offerings up to 32 layers, we maintain stringent specifications for manufacturing and employ the best practices. We divided our offerings into three categories, standard, critical, and most critical. For manufacturing multilayer PCBs as per the requirements, we follow the following technical specifications.

PARAMETERS  STANDARD CRITICAL MOST CRITICAL
Layer Count Upto 12 Layer 12 to 32 Layers 26-32 LAYER
0.25-0.30 MM 0.15 MM 0.10 MM
Minimum size of slot 0.80 MM 0.7 0.7
Minimum Annular Ring for via holes [Inner & outer] 0.1-0.15 MM 0.075 MM 0.075 MM
Minimum Annular Ring for component holes [Inner & outer] 0.15 MM 0.10 MM 0.075 MM
Minimum Outer layer track / space 0.10/0.10 MM 0.075/0.075MM 0.05/0.05 MM
Minimum inner layer track / space 0.10/0.10 MM 0.075/0.075MM 0.05/0.05 MM
Minimum inner layer (Antipad) drill to copper isolation 0.20 MM 0.175 MM 0.15 MM
Minimum board edge to copper clearance [Routed Boards] 0.15 MM 0.10 MM 0.10 MM
Minimum board edge to copper clearance [Scored Boards] 0.35 MMl 0.30 MMl 0.25MM
Minimum Solder Mask Clearance 0.05 MM 0.025 MM 0.0127 MM
Minimum width of Solder Mask dam 0.125 MM 0.10 MM 0.075 MM
Minimum total width for legend printing 6 mil 4 mil 4 mil
Minimum SMD pitch 20 mil 16 mil 16 mil
Minimum BGA pitch 24 mil 16 mil 16 mil
Aspect Ratio (Thickness to Drill) 12:01 16:01 16:01
Blind Via 1 + N + 1 1 + N + 1 1 + N + 1
Burried Via Internal Layers Connectivity Leaving leaving Top & Bottom Layer
Hole Fill / Cap Plate  ( Min. Hole ) 8 mil <8 mil <8 mil
Control Impedance Toll. +/- 10% Toll. +/- 5% Toll. +/- 5%