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Prism Circuitronics
About
Services
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Multi Layer PCBs 4 to 32 Layers
Edge Plating Boards
Solder Mask Plugged Via
Press Fit
High Copper PCBs
Via In PAD PCBs Filled with Silver
Blind Buried PCBs
On Board PCBs For Space Applications
Capabilites
Menu Toggle
Plant Capabilities
Machineries
DFM – Tech Specification
Certificates & Approvals
Contact
About
Services
Menu Toggle
Multi Layer PCBs 4 to 32 Layers
Edge Plating Boards
Solder Mask Plugged Via
Press Fit
High Copper PCBs
Via In PAD PCBs Filled with Silver
Blind Buried PCBs
On Board PCBs For Space Applications
Capabilites
Menu Toggle
Plant Capabilities
Machineries
DFM – Tech Specification
Certificates & Approvals
Contact
Search …
Prism Circuitronics
Main Menu
About
Services
Menu Toggle
Multi Layer PCBs 4 to 32 Layers
Edge Plating Boards
Solder Mask Plugged Via
Press Fit
High Copper PCBs
Via In PAD PCBs Filled with Silver
Blind Buried PCBs
On Board PCBs For Space Applications
Capabilites
Menu Toggle
Plant Capabilities
Machineries
DFM – Tech Specification
Certificates & Approvals
Contact
Via In PAD PCBs Filled with Silver
We offer Via filled with Silver conductive ink for Via in Pad PCBs for Planarize high dense PCBs for BGA / SMD.
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